Supplier Day
Space for dialog across the semiconductor supply chain enabling suppliers, manufacturers, and ecosystem partners to connect, build strategic partnerships and discuss new business opportunities.
This Supplier Day offers a unique platform to meet key industry players, explore collaboration potential, and position your company within the rapidly evolving semiconductor ecosystem. Engage directly with decision-makers, discover upcoming projects and procurement needs, and strengthen your presence in one of Europe’s most strategic industrial sectors.
Participants will meet with experts from EUROPEAN PASSIVE COMPONENTS INSTITUTE and International Microelectronics and Packaging Society – IMAPS CZ/SK and join Supply Chain Management seminar. Flash presentation will introduce key manufacturers of technologies for semiconductor manufacturing.
Participation in the workshop is free, but the number of places is limited, therefore registration is required.
Program
8:30 Registration
9:00 Word of Welcome
David Müller, Director General at the Section of European Union and Foreign Trade, Ministry of Industry and Trade
9:05 Key note
9:10 – 9:25 Czech Semiconductor Center
Karel Masařík, RISC-V Fellow, Czech Semiconductor Center
9:25 – 9:40 Passive Components Development Requirement in Consequence of Semiconductor Trends /European Passive Components Institute/
Tomáš Zedníček, President and Founder of EPCI – European Passive Components Institute
9:40 – 9:55 International Microelectronics and Packaging Society /IMAPS CZ/SK/
Alexandr Otáhal, President of the IMAPS Czech & Slovak Chapter
MAIN CONFERENCE HALL:
9:55 – 10:55 Supplier introduction – flash presentation 5 minutes per company
MEETING ROOMS:
Programme for development of semiconductor suppliers – seminars and consultations
Meeting Room Silesia
9:55 – 10:55 Seminar on Supplier Financing and Insurance in the Semiconductor Industry followed by individual consultations.
Programme in Czech Language only
Česká exportní banka seminář (15 min): Možnosti úvěrování dodavatelů v polovodičovém průmyslu
Seminář představí možnosti financování a pojištění vývozu a investic českých dodavatelů v polovodičovém průmyslu. ČEB rozebere financování vývozu, investic, provozních potřeb a akvizic. Vysvětlí fungování dodavatelských/odběratelských úvěrů, investičních úvěrů, produktů trade finance i podpory českých vývozně orientovaných podniků. EGAP přiblíží nástroje pojištění exportních pohledávek, dodavatelských úvěrů a bankovních záruk, stejně jako podporu vývozně orientovaných podniků při financování rozvoje výroby a investic či pojištění samotných investic v zahraničí. Po prezentacích bude následovat prostor pro individuální konzultace konkrétních obchodních a investičních záměrů.
Lectured by: Miroslav Stříbrný, Director of the Trade and Export Finance Division, Czech Export Bank
The seminar will present financing and insurance options for exports and investments by Czech suppliers in the semiconductor industry. ČEB will discuss financing for exports, investments, working capital, and acquisitions. It will explain how supplier/buyer credits, investment loans, trade finance products, and support for Czech export-oriented companies work. EGAP will outline tools for insuring export receivables, supplier credits, and bank guarantees, as well as support for export-oriented companies in financing production development and investments or insuring the investments themselves abroad. The presentations will be followed by an opportunity for individual consultations on specific business and investment plans.
Export Bank (CEB) is a specialised state-owned banking institution, part of the system of state export support and economic diplomacy of the Czech Republic, helps Czech exporters and investors to grow and succeed on international markets as well as international customers to purchase Czech products, technological units and services.
Programme in Czech Language only
EGAP seminář (15 min): Možnosti pojištění a financování dodavatelů v polovodičovém průmyslu – role EGAP
Seminář představí možnosti pojištění exportu a investic českých dodavatelů v polovodičovém průmyslu. EGAP přiblíží nástroje pojištění exportních pohledávek, dodavatelských úvěrů a bankovních záruk, stejně jako podporu exportně orientovaných podniků při financování rozvoje výroby a investic či pojištění samotných investic v zahraničí.
The seminar will present insurance options for exports and investments by Czech suppliers in the semiconductor industry. EGAP will outline its tools for insuring export receivables, supplier credits, and bank guarantees, as well as support for export-oriented companies in financing production development and investments, or insuring the investments abroad.
Po krátké prezentaci bude následovat prostor pro individuální konzultace konkrétních obchodních a investičních záměrů.
Lectured by: Jan Dubec, Director of the Department of Acquisitions and Supplier Credit Insurance, EGAP
Export Guarantee and Insurance Corporation (EGAP)
A fully state-owned joint stock company providing services to Czech exporters and investors. EGAP fills gaps in export and investment finance market and enhances the ability of exporters and investors to adapt to dynamic developments and challenges in a globalised trading environment.
11:00-11:45 Financování inovací v polovodičovém průmyslu: daňové odpočty a dotační příležitosti Grant Thornton – Association for Foreign Investments
Prezentace Grant Thornton představí možnosti využití vybraných přímých finančních podpor v polovodičovém průmyslu, kterému s ohledem na současný rostoucí význam celého odvětví věnuje veřejný sektor zvýšenou pozornost. Přednášející rozeberou možnosti daňových odpočtů ve výzkumu a vývoji prostřednictvím odčitatelných položek. Dozvíte se, k čemu slouží odpočet na VaV, kdo jej může uplatnit a jaké přináší daňové úspory. Prakticky vysvětlíme podmínky, časté chyby i přínosy pro firmy realizující inovace. Obdobně pak přednášející představí pilotní dotační výzvy v rámci platformy STEP zaměřené jak na financování VaV, tak také nové možnosti v oblasti spolufinancování produktivních investic. Po prezentacích bude následovat prostor pro individuální konzultace konkrétních záměrů.
Lectured by: Petra Vaněčková – Tax Partner; Ondřej Miffek – Head of Dotace | Advisory
Seminar followed by individual consultations.
Contribution of an AFI Member
Meeting Room Moravia
10:00-10:45 Decoding the Semiconductor Supply Chain – English
Lectured by: Lee Eden, Partner at Pacellico, Planning, Supply Chain, Digitalization
The Semiconductor industry is highly cyclical with extreme peaks and troughs of demand. Will AI continue to drive high levels of growth, will geopolitical issues drive the global economy into recession, will EV transition accelerate? Whichever trend dominates, as a semiconductor supplier you will need the processes and tools to build flexibility in your supply-chain and in-house capacity. In this session we will discuss how best to do that, and how to profit and succeed in this challenging environment.
10:45-11:30 Semiconductor Industry: Technology Drivers, Quality and Compliance – English
Lectured by: Rob Fell, Senior Consultant, Pacellico, Asia Pacific Operations, Engineering & Procurement
Semiconductor customers demand that rigorous protocols are followed to safeguard product quality, supply chain integrity, and protect the facilities that produce their products. This session explores these requirements by navigating through supplier selections, material equivalencies, compliance, and change management structures that ensure continuity of supply. Finally, a look to the future and how rapid advances in technology and shifting demand may influence supply chains over the next 5-10 years.
Would you like to introduce your company in a flash presentation at Supplier Day? Fill out this short form
Date
- 18 May 2026
Time
- 08:30 - 13:00
More Info
Location
- Bubeneč 391, 170 00 Praha 7, Czechia
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Website
https://navystavisti.cz/grounds/bohemia_pavilion/ -
Trams Výstaviště tram stop. Trams no. 6, 12, 17, 53, 54 Parking There are 3 public parking lots at Výstaviště: P1, P2 and P3 Access to the inner area of the Exhibition Grounds is only permitted with a special authorization card issued by Výstaviště Praha, a.s.
Speakers
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Jan DubecExport Guarantee and Insurance Corporation (EGAP)Jan Dubec works at the Export Guarantee and Insurance Corporation (EGAP) as Director of the Acquisition and Supplier Credit Insurance Department. He studied insurance and finance at the Banking Academy and the University of Finance and Administration.
He has been working in the field of credit insurance since 1994, when he started at EGAP, and also gained professional experience at the commercial credit insurance company Credendo (formerly KUPEG). At EGAP, he has held various specialist and management positions, and since 2017 he has been Director of the Acquisition and Supplier Credit Insurance Department.
He regularly speaks at EGAP professional events and also represents EGAP at seminars and conferences of partner institutions, particularly in cooperation with the Czech Chamber of Commerce, ministries, and other entities, where he focuses on the practical use of export insurance tools in business. -
Tomáš ZedníčekEuropean Passive Components InstituteTomas Zednicek received his PhD in electro-technology with a focus on tantalum capacitors from Brno University of Technology in 2000 and spent 20 years at KYOCERA AVX in engineering, quality, failure analysis, research, and worldwide technical marketing roles for tantalum capacitors. In 2015, he founded the European Passive Components Institute (EPCI) and its website www.passive-components.eu, now a leading global blog on passive electronic components and organizer of the bi-annual PCNS Passive Components Networking Symposium in cooperation with European universities.
He has contributed to high-energy, high-density capacitor development for applications from industrial and automotive to high-reliability space systems, including EC H2020 projects and ESA activities such as capacitor bank design for the Mars Curiosity rover’s ChemCam laser power supply. Tomas is the author of over 70 technical papers, one US/international patent (USA 7,352,563 B2), and has received multiple CARTS Best Paper and Outstanding Paper awards as well as the 2005 Dr. Zandman Award for contributions to the passive component industry.
He is actively involved in university collaborations on passive component education and, in 2024, co-founded Atomiver www.atomiver.com, a university spin-out developing graphene-based high-energy materials for supercapacitors and related applications. -
Lee EdenPartner at Pacellico, Planning, Supply Chain, DigitalizationLee Eden has extensive experience in global supply chain, logistics and customer operations. His career has taken him through FMCG, electronics manufacturing & repair, logistics services and industrial equipment sectors.
He managed the Supply Chain function of large manufacturing sites, owning planning, purchasing, warehousing and transportation. Key challenges included reduction of inventory and negotiation of liability agreements, resolution of system inventory integrity.As European Customer Development Manager at Flextronics, Lee developed best practices in Program Management, Pricing and Contract Management. He was responsible for review and confirmation of manufacturing quotations and contracts.
Lee was the EMEA Logistics Manager for Celestica, supporting multiple sites, and Global Director of Logistics Contracts, managing an annual Global freight spend of $70m.
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Rob FellSenior Consultant, Pacellico, Asia Pacific Operations, Engineering & ProcurementWith over 30 years of engineering experience in the Automotive, Semiconductor Industrial Equipment and Telecoms/Consumer Electronics industries, Rob Fell is an established professional with a deep understanding of a wide range of technologies.
Formerly Principal Engineer for Daewoo-General Motors, Rob has partnered with several major global OEMs to develop emerging & innovative technologies that are commonplace on our vehicles today.
Working for a Global leader in Semiconductor industrial equipment manufacture and with commodity responsibility for high-technology components, Rob managed the transfer of a US$100m portfolio of performance-critical parts and assemblies into Asia using extensive supplier development and process capability programmes, underpinned with balanced & mutually beneficial contractual locks.
Previously, Rob has worked in the telecommunications, audio, and consumer electronics sectors where he specialised in the design, development & production of high-end user interfaces.
Now based in Thailand and having lived and worked extensively in the US, Korea, and Japan, Rob additionally brings to Pacellico a deep knowledge of sourcing, supplier development and engineering within the Asia-Pacific region.
